ETH students awarded at IEEE heat sink challenge
Outstanding demonstration of the design opportunities of the AM technology ‘Metal Binder Jetting’ by a group of students from the Design for Additive Manufacturing lecture
A group of students from the Design for Additive Manufacturing lecture at ETH Zurich successfully participated in the ITherm 2024 conference in Denver, Colorado. They received the second price at the Heat Sink Challenge. The students submitted a stainless-steel heat sink design using the cost efficient additive manufacturing (AM) technology, Metal Binder Jetting.
The Heat Sink Challenge, a key event at the ITherm conference, required participants to design, build, and validate a heat sink made with advanced AM methods, supported by GE’s additive manufacturing machines. The ETH Zurich team, composed of master's students, was invited to present their work after their design performed well in preliminary tests.
The journey began in early 2024 when the team submitted a white paper detailing their design. The paper, which included preliminary test results and modeling, was selected as one of the top entries, allowing the team to proceed to the next stage. After refining their design to meet printing requirements, the team successfully produced their heat sink, which was then tested for performance.
At the ITherm conference, the team’s heat sink demonstrated solid performance on the test bench, effectively managing heat dissipation. Their presentation focused on how they utilized the design flexibility of Metal Binder Jetting to improve thermal efficiency.
For more info please contact Maximilian Reikat or Julian Ferchow.
